MEMS技术天地-中国微米纳米学会的专业交流论坛

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Content
Chapter 1. Introduction to MEMS devices
1.1. Piezoresistive pressure sensor
1.2. Piezoresistive Accelerometer
1.3. Capacitive Pressure Sensor, Accelerometer and Microphone
1.4. Resonant Sensor and Vibratory Gyroscope
1.5. Micro Mechanical Electric and Optical Switches
1.6. Micro Mechanical Motors
1.7. Micro Electro Mechanical Systems
1.8. Analysis and Design of MEMS Devices

Chapter 2. Basic Mechanics of Beam and Diaphragm Structures
2.1. Stress and Strain
2.2. Stress and Strain of Beam Structures
2.3. Vibration Frequency by Energy Methods
2.4. Vibration Modes and the Buckling of a Beam
2.5. Damped and forced vibration
2.6. Basic Mechanics of Diaphragms
2.7. Problems

Chapter 3. Air Damping
3.1. Drag Effect of a Fluid
3.2. Squeeze-film Air Damping
3.3. Damping of Perforated Thick Plates
3.4. Slide-film Air Damping
3.5. Damping in Rarefied Air
3.6. Problems

Chapter 4. Electrostatic Actuation
4.1. Electrostatic Forces
4.2. Electrostatic Driving of Mechanical Actuator
4.3. Step and Alternative Driving
4.4. Problems

Chapter 5. Capacitive Sensing and Effects of Electrical Excitation
5.1. Capacitive Sensing Schemes
5.2. Effects of Electrical Excitation-Static Signal
5.3. Effects of Electrical Excitation-Step Signal
5.4. Effects of Electrical Excitation-Pulse Signal
5.5. Problems

Chapter 6. Piezoresistive Sensing
6.1. Piezoresistive Effect of Silicon
6.2. Coordinate Transformation of Second Rank Tensors
6.3.Coordinate Transformation of Piezoresistive Coefficient
6.4. Piezoresistive Sensing Elements
6.5. Polysilicon Piezoresistive Sensing Elements
6.6. Analyzing Piezoresistive Bridge
6.7. Problems